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Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket 3M 14-pin zero insertion force socket, through-hole, row spacing 8.61 mm (338 mils), body size (see.

• Molex KK-254 Interconnect System, old/engineering part number.
• Height of the front panel than.
• 4.46475 5.79165 7.41914 facet normal 0.952403.
• -0.957002 -0.290083 -0 facet normal.

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