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(https://www.onsemi.com/pub/Collateral/NB3N551-D.PDF#page=7), generated with kicad-footprint-generator Hirose series connector, 502443-0770 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1010, with PCB locator, 7 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog&lang=en&documentid=D31688_en), generated with kicad-footprint-generator connector wire 1.5sqmm double-strain-relief Soldered wire connection with feed through strain relief, for 6 times 0.75 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 3.5mm, size 43x8.3mm^2, drill diamater 1.3mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal.

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