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WSON6 3*3 MM, 0.95 PITCH; CASE 506AH-01 (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 28 leads; body width 4.4 mm; Exposed Pad Variation BB; (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CN (see ON Semiconductor 506AH.PDF DFN, 6 Pin (http://www.onsemi.com/pub/Collateral/NCP133-D.PDF), generated with kicad-footprint-generator connector wire 1.5sqmm strain-relief Soldered wire connection with double feed through strain relief, for 2 times 2.5 mm² wire, basic insulation, conductor diameter 1.25mm, outer diameter 2.1mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00045_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block 4Ucon ItemNo. 10697 vertical pitch 3.5mm size 35.7x7mm^2 drill 1.2mm pad 3mm Terminal Block WAGO 236-303, 45Degree (cable under 45degree), 16 pins, dual row male, vertical entry Harwin LTek Connector, 4 pins, pitch 10mm, size 25x9mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block WAGO 236-124.

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