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BackEnhanced Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 9x-dip-switch SPST Omron_A6S-910x, Slide, row spacing 7.62 mm (300 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile DIP Switch SPST 1P1T straight NO SMTR C&K E-Switch sub miniature slide switch, right-angle, http://www.ckswitches.com/media/1422/js.pdf.
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