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Back9x9mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf UFBGA-132, 12x12 raster, 10x10mm package, pitch 0.4mm pad, based on https://www.schmitzbits.de/ms20.html which is a ceramic 104 power cap like C5, C6, C8, C9, C11, C12; space accordingly Move any UX connections on the same size as traces - vias connect through the power subsystem 972d8b1e07 adds front panel 24ca7abc85681936397a2802c8155420fcaf679c updated C14 footprint, traces, groundplane updated C5 footprint & tracing; schematic annotation updated C5 footprint & tracing; schematic annotation Add 55k-ish resistor to coarse knob (doublecheck this placement). Actual value unclear (see below).
Argument for a single 0.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (http://www.fujitsu.com/ca/en/Images/MB85RS2MT-DS501-00023-1v0-E.pdf), generated with kicad-footprint-generator connector wire 0.1sqmm double-strain-relief Soldered wire connection with double feed through strain relief, for 6 times 1.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 https://www.wolfspeed.com/media/downloads/87/CSD01060.pdf TO-252 / DPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-5-11/ DPAK TO-252 DPAK-5 TO-252-5 TO-263 / D2PAK / DDPAK SMD package, tab to pin.
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