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PN:G125-MVX5005L1X Harwin LTek Connector, 5 pins, single row style1 pin1 left Surface mounted pin header SMD 1x18 1.00mm single row male, vertical entry, strain relief clip Harwin LTek Connector, 12 pins, pitch 5.08mm, size 50.8x10.6mm^2, drill diamater 1.3mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00024 pitch 10mm size 45x10.3mm^2 drill 1.3mm pad 2.6mm Terminal Block 4Ucon ItemNo. 20001 pitch 3.5mm size 46.2x7mm^2 drill 1.2mm pad 3mm Terminal Block WAGO 236-124, 45Degree (cable under 45degree), 6 pins, pitch 10mm, size 95x10.3mm^2, drill diamater 1.1mm, pad diameter 2.5mm, hole diameter 1.4mm, outer diameter 3mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc0015.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 5-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 3x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 8-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD DIP Switch SPST Slide 8.61mm 338mil SMD LowProfile SMD 8x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x9.18mm 3x-dip-switch SPST , Piano, row spacing 5.08 mm (200 mils), body size 10.8x4.1mm DIP Switch SPST Slide 7.62mm 300mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 6.15 mm (242 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 1x-dip-switch SPST , Piano, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP Switch SPST Slide 7.62mm 300mil 1x-dip-switch SPST Copal_CHS-01B, Slide, row spacing 7.62 mm (300 mils), Socket 20-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.8mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32f042k6.pdf WLCSP-36, 6x6 raster, 2.5x2.5mm package.

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