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Clearance8mm 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), missing pin 5, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see.

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