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Mpn: 39-28-914x, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.5 mm² wire, basic insulation, conductor diameter 1.25mm, outer diameter 1.5mm, hole diameter 1.3mm, wire diameter 1.0mm wire loop with bead as test Point, square 2.0mm side length SMD rectangular pad as test point, loop diameter 3.8mm, hole diameter 1.3mm, wire diameter 1.0mm wire loop with bead as test point, pitch 5.08mm, size 15.2x11mm^2, drill diamater 1.3mm, pad.

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