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14-lead dip package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 22-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm.

• Header, 1x05, 2.54mm pitch, single row.
• -0.468306 -0.0703599 facet normal 0.828696.
• 9.999915e-001 0.000000e+000 facet normal.
• 0.758301 0.622313 0.19418 vertex.

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