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THD 15WIN, 15W, THT (https://www.tracopower.com/products/thd15win.pdf#page=3 traco dcdc tht 15w DCDC-Converter, TRACO, TEN10-xxxx, single output, SIP package style, https://power.murata.com/data/power/ncl/kdc_mej1.pdf Abracon Miniature Ceramic Smd Crystal ABM3 http://www.abracon.com/Resonators/abm3.pdf, 5.0x3.2mm^2 package 14-lead dip package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 9x-dip-switch SPST CTS_Series194-9MSTN, Piano, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 5.08mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MT MOSFET Infineon PLCC, 20 pins, dual row male, vertical entry Harwin LTek Connector, 26 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/44L_VQFN_5x5mm_Dual_Row_%5BS3B%5D_C04-21399a.pdf QFN, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-2549-8-bit-AVR-Microcontroller-ATmega640-1280-1281-2560-2561_datasheet.pdf (page 415)), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 1.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator TE, 826576-8, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose series connector, 78171-0003 (http://www.molex.com/pdm_docs/sd/781710002_sd.pdf), generated with kicad-footprint-generator Soldered wire.

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