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Number: 1777219 12A Generic Phoenix Contact connector footprint for: MSTBA_2,5/9-G-5,08; number of pins: 10; pin pitch: 5.00mm; Vertical || order number: 1924172 16A (HC Generic Phoenix Contact connector footprint for: MSTBA_2,5/7-G; number of pins: 09; pin pitch: 3.81mm; Angled || order number: 1830729 8A 160V Generic Phoenix Contact SPT 2.5/8-H-5.0-EX Terminal Block, 1719419 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719419), generated with kicad-footprint-generator connector JST EH series connector, BM09B-ZESS-TBT (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 64 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/70593d.pdf), generated with kicad-footprint-generator JST XH series connector, B07B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator JST PHD series connector, SM20B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator connector JST JWPF series connector, S2B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator connector wire 0.25sqmm strain-relief Soldered wire connection with double feed through strain relief, for 4 times 0.15 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Sabre Power Connector, 46007-1104, With thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST PH series connector, SM10B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 16 Pin package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x11.72mm 4x-dip-switch SPST Copal_CVS-04xB, Slide, row spacing 8.9 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 15.24mm 600mil Socket 3M 14-pin zero insertion force socket, through-hole, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 7x-dip-switch SPST , Piano, row spacing 6.15 mm (242 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 2x-dip-switch SPST CTS_Series194-2MSTN, Piano, row spacing 7.62 mm (300 mils), body size 10.8x9.18mm 3x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 12-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm.

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