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Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip, 1x07, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 2x38 2.54mm double row Through hole Samtec HPM power header series 11.94mm post length THT 1x06 1.00mm single row Through hole socket strip SMD 2x19 2.54mm double row surface-mounted straight pin header, 2x27, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled socket strip THT 1x33 2.54mm single row style1 pin1 left Surface mounted pin header THT 2x20 1.27mm double row Through hole IDC header, 2x32, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC box header THT 1x24 2.54mm single row style1 pin1 left Surface mounted pin header THT 2x09 2.00mm double row Through hole angled pin header, 1x01, 2.00mm pitch, 4.2mm pin length, single row Through hole straight pin header, 1x34, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x04, 1.00mm pitch, single row Surface mounted.

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