Labels Milestones
BackPin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition Appendix A Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A Artix-7 BGA, 16x16 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition Appendix A Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias in pads, 5 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 8, Wuerth electronics 9775076360 (https://katalog.we-online.com/em/datasheet/9775076360.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0410, with PCB cutout, light-direction upwards, see http://www.everlight.com/file/ProductFile/ITR8307.pdf refective opto couple photo coupler IR Receiver Vishay TSOP-xxxx MINICAST IR Receiver Vishay TSOP-xxxx, CAST package, see https://www.vishay.com/docs/82742/tsop331.pdf IR Receiver Vishay TSOP-xxxx MOLD Oscillator, DIP8, Large Pads, http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf Miniature Crystal Clock Oscillator Abracon ASE series, http://www.abracon.com/Oscillators/ASEseries.pdf, hand-soldering, 3.2x2.5mm^2 package crystal Epson Toyocom FA-238.
- Strip, labeled with numbers SMD Solder Jumper, 1x1.5mm.
- -5.38424 6.90036 vertex -5.16382.
- Vertex -5.3829 4.57828 7.06725 vertex -4.78839.
- Of Source Form All.
- MKDS-1,5-7, 7 pins, pitch 2.54mm, size 28.4x6.2mm^2, drill.