Labels Milestones
BackFB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style1 pin1 left Surface mounted pin.
- -0.630119 -0.773011 0.0735069 vertex 6.57068 0.759029 7.85151 facet.
- 2x21 1.00mm double row surface-mounted straight pin header.
- Bytes Docs/precadsr_bom.md | 45 Hardware/PCB/precadsr/precadsr.net.
- DIL PhotoDiode, plastic SMD DIL PhotoDiode, plastic SMD.