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Https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole horizontal IDC box header THT 2x40 1.00mm double row Through hole socket strip THT 2x16 2.54mm double row Through hole angled socket strip THT 2x29 1.00mm double row Through hole pin header THT 2x04 1.27mm double row Through hole pin header THT 1x28 1.00mm single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x28 1.27mm single row style2 pin1 right Through hole angled pin header THT 1x33 1.00mm single row Through hole angled pin header, 1x40, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 1x40 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x18 1.27mm single row style2 pin1 right Through hole straight pin header, 2x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header 2x20 2.54mm double row Through hole vertical IDC header THT 2x04 2.00mm double row Through hole straight pin header, 2x22, 1.27mm pitch, single row Through hole socket strip.

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