Labels Milestones
BackBGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD.
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Connector
2 pin Molex. - -0.634276 0.09931 facet normal -1.087091e-001 -4.840734e-004.
- Bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3.