Labels Milestones
Back200528-0050, 5 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator JST XA series connector, SM11B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator connector Molex KK-254 Interconnect System, old/engineering part number: 26-60-5050, 5 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 24 Pin (https://www.invensense.com/wp-content/uploads/2015/02/PS-MPU-9250A-01-v1.1.pdf#page=39), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-4DP-2DSA, 2 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 1.5 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Fuse SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator JST VH PBT series connector, 502443-0270 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TDFN, 8 Pin (http://www.ti.com/lit/ml/mpds400/mpds400.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic Dual Flat No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 16x16 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466.
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