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Socket 20-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 10.9mm TO-247-3, Horizontal, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 1.27mm MultiwattF-15 staggered type-1 TO-220F-7 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220F-7, Vertical, RM 1.7mm, MultiwattF-11, staggered type-1, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 2.54mm TO-220-3, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-1 TO-220F-15 Vertical RM 2.54mm staggered type-1 TO-220F-5 Vertical RM 2.29mm IPAK TO-262-3, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-9 Horizontal RM 2.54mm staggered type-1 TO-220-11, Horizontal, RM 1.7mm, MultiwattF-11, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Horizontal RM 10.95mm SOT-93 TO-218-3, Horizontal, RM 2.54mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Horizontal RM 2.54mm staggered type-2 TO-220-4 Horizontal RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Horizontal RM 2.54mm TO-247-4, Vertical, RM 1.27mm, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Horizontal RM 2.54mm staggered type-1 TO-220-5, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-2, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 1.7mm IIPAK I2PAK TO-262-3, Vertical, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Vertical RM 5.45mm TO-3PB-3, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads THT DIP DIL ZIF 25.4mm 1000mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 22-lead surface-mounted (SMD) DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x14.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 12x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket 10-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 6x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 10.8x11.72mm 4x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 24-lead though-hole.

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