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Outline (SM) - 5.28 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil.

• 2x22, 1.27mm pitch, 4.0mm.
• Electronics 9774010482 (https://katalog.we-online.de/em/datasheet/9774010482.pdf), generated.
• 5.5107 7.08096 vertex -5.62839 -4.67928 7.09583.

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