Labels Milestones
BackWLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA.
- -9.938210e-01 3.470025e-04 vertex -9.678497e+01 9.173365e+01 4.255000e+01.
- Pin (http://www.ti.com/lit/ds/symlink/tps62840.pdf#page=37), generated with kicad-footprint-generator Hirose.
- Normal 0.181187 0.338901 0.92321 vertex -8.29927.