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YFF S-XBGA-N5 Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant BA), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 64 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Molex SPOX Connector System, 43045-0221 (alternative finishes: 43045-182x), 9 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-02A example for new part number: 26-60-5030, 3 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MCV_1,5/9-GF-3.81; number of pins: 04; pin pitch: 7.62mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1829219 12A 630V Generic Phoenix Contact connector footprint for: MC_1,5/3-G-3.5; number of pins: 08; pin pitch: 3.81mm; Angled || order number: 1803565 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/15-GF-3.5; number of pins: 11; pin pitch: 3.50mm; Vertical; threaded flange || order number: 1766835 12A 630V Generic Phoenix Contact connector footprint for: MCV_1,5/6-GF-3.81; number of pins: 13; pin pitch.

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