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BackVery Thin Dual Flatpack No-Lead Package, 3x3mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-Lead Plastic DFN (5.55mm x 5.2mm), Pin 5-8 connected to trigger, gate jack is normalized\nto +12 V, and sustain voltage is taken from \npot pin 1. Cmp-Mod V01 Created by Cvpcb (2015-03-25 BZR 5536)-product date = sam. 04 avril 2015 11:21:18 UTC update=Tue 20 Apr 2021 10:45:56 AM EDT Mon 10 May 2021 12:33:34 AM EDT R14, R15 values changed\ndue to availability Kassu used 1 µF \npolyester film looks much \nbetter. Low-Power, Quad-Operational Amplifiers, DIP-14/SOIC-14/SSOP-14