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DirectFET S1 MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET MX MOSFET Infineon DirectFET MZ MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET SJ MOSFET Infineon DirectFET SQ MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET ST MOSFET Infineon PLCC, 20 pins, single row style2 pin1 right Through hole angled socket strip, 2x13, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x23, 1.00mm pitch, 2.0mm pin length, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip SMD 1x21 1.27mm single row male, vertical entry, PN:G125-FVX2005L0X Harwin Gecko Connector, 50 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package - 4.0x4.0x0.8 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack No-Lead Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf DFN, 6 Pin (https://www.onsemi.com/pdf/datasheet/ncp349-d.pdf#page=12), generated with kicad-footprint-generator connector Molex SPOX Connector System, 5267-11A, 11 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Quad Flat, No Lead Package - 10x10x0.9 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 6x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket.

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