Labels Milestones
BackSOIC SOIC-8 Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias 10-Lead Plastic XDFN (1.35mm x 2.2mm) (see https://www.onsemi.com/pdf/datasheet/emi8132-d.pdf Thermally-enhanced SO-8 PowerPAK PQFN Q5A PowerFLAT LFPAK SOT669 WPAK(3F) LFPAK Power56 PMPAK PowerDFN56 HSOP8 PRPAK56 PDFN HVSON QFN, 24.
- 40 lines default_label_font .
- LongPads 32-lead though-hole mounted DIP package, row.
- B11a8d31874f2e074879a668b4f6eb5f32915bd6 Mon Sep 17.
- 1x11 1.27mm single row Surface.