Labels Milestones
BackWLCSP-115, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, DSC0010J, WSON.
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// testing futura vs quentincaps in F6 rendering. - Or counter-claims. 9. Miscellaneous This License.
- (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719341), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 48.