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(MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked.

• X="4.9" y="1.5"/> 2.63805 1.98496 18.4724 vertex 3.08346 -1.31835.

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