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SMD 1x14 1.00mm single row style2 pin1 right Through hole angled socket strip THT 1x26 1.27mm single row Surface mounted socket strip SMD 1x31 1.00mm single row style2 pin1 right Through hole IDC box header, 2x07, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x05, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted pin header SMD 1x24 1.00mm single row style1 pin1 left Surface mounted pin header THT 1x03 1.00mm single row Surface mounted pin header SMD 1x39 2.00mm single row Through hole pin header THT 1x16 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x05 2.54mm double row Through hole angled pin header THT 1x05 1.00mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x23 2.54mm double row Through hole angled pin header, 2x33, 1.00mm pitch, single row Through hole straight Samtec HPM power header series 3.81mm post length, 1x15, 5.08mm pitch, see http://www.vishay.com/docs/88606/g3sba20.pdf Vishay GBU rectifier diode bridge DFS, see http://www.vishay.com/docs/88854/padlayouts.pdf TO-269AA MBS diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://cds.linear.com/docs/en/packaging/SOT_8_05-08-1637.pdf Texas Instrument DRT-3 1x0.8mm Pitch 0.7mm http://www.ti.com/lit/ds/symlink/tpd2eusb30.pdf DRT-3 1x0.8mm Pitch 0.7mm Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 14x14 grid, 8x8mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon.

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