synth_tools

Back

43045-1421 (alternative finishes: 43045-140x), 7 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System, 53047-1110, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-172 , 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Panelmate series connector, S12B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, 502382-1070 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xxx-DV, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 42819-22XX, With thermal vias (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-9/ Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal vias in pads, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST VH PBT series connector, LY20-42P-DT1, 21 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 52 Pin (JEDEC MS-013AB, https://www.analog.com/media/en/package-pcb-resources/package/33254132129439rw_18.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator connector Molex SPOX Connector System, 43045-0200 (alternative finishes: 43045-120x), 6 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator JST VH side entry Molex Panelmate series connector, DF3EA-07P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing⟨=en&documentid=0001163317), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2102, 2 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator JST VH series connector, S11B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator connector wire 0.75sqmm strain-relief Soldered wire connection with double feed through strain relief, for 5 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Connector Phoenix Contact, SPT 5/9-H-7.5-ZB Terminal Block, 1719383 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719383), generated with kicad-footprint-generator Mounting Hardware, inside through hole lga land grid array Bosch LGA, 8 Pin (https://www.ti.com/lit/ml/msop001a/msop001a.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 5, Wuerth electronics 9774070960 (https://katalog.we-online.de/em/datasheet/9774070960.pdf,), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.5mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 3.347x3.585mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.5mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf WLCSP-143, 11x13 raster, 4.539x5.849mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A.

New Pull Request

Labels Milestones