Labels Milestones
Back32-lead dip package, row spacing 7.62 mm (300 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads.
- Test point THT pad as test point.
- (https://www.st.com/resource/en/datasheet/stm32f207vg.pdf#page=163), generated with kicad-footprint-generator JST VH series connector.