Labels Milestones
BackNexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead.
- Pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed.
- 5.756167e-001 7.010823e+000 1.747200e+001 facet normal -0.957368 0.115024 0.264982.
- Type175_RT02703HBLC pitch 7.5mm size 60x10.3mm^2 drill.