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Size 10.8x19.34mm 7x-dip-switch SPST KingTek_DSHP07TJ, Slide, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), missing pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body [HTSSOP], with thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flat, No Lead Package - 3x3 mm Body [UDFN] (See http://www.onsemi.com/pub/Collateral/NLSV2T244-D.PDF dfn udfn dual flat OnSemi VCT, 28 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-28/CP_28_10.pdf), generated with kicad-footprint-generator Capacitor SMD Kemet-U (6032-15 Metric), IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 5569-18A2, example for new mpn: 39-28-x08x, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam.

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