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Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984.

Normal 0.561106 0.299919 0.771497 facet normal -2.777580e-17.
With ground pin http://www.ckswitches.com/media/1479/kmr2.pdf tactile.
-1.827712e-13 -1.000000e+00 -1.088558e-13 facet normal -0.0925097 0.0580283 0.994019.
Strip, HLE-138-02-xx-DV-TE, 38 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN.

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