Labels Milestones
Back14.5x10.0mm, 200 Ball, 12x22 Layout, 0.8x0.65mm Pitch, http://www.issi.com/WW/pdf/43-46LQ32256A-AL.pdf Altera BGA-256 M256 MBGA BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 7x7mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip SMD 2x06 1.27mm double row surface-mounted straight pin header, 2x16, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x02, 1.00mm pitch, double rows Surface mounted pin header THT 1x08 2.00mm single row Through hole straight pin header, 2x15, 1.27mm pitch, 4.4mm socket length, double rows Through hole socket strip.
- | 10uF | Electrolytic capacitor .
- Additions 2018-03-14 21:06:04 -07:00 From f5e6b8a4df714a1a2bca4fe779760c14f25ac698 Mon.
- 4.63084 0.710463 18.8084 vertex 4.16916 -0.710463.
- Vertex 4.32242 -0.23878 18.7299.
- Rounded top edge. [mm] top_rounding_radius = 8.