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High-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch.

For: MC_1,5/8-GF-3.5; number of pins: 04.
Three Panel Soul elseif.
Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch.

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