Labels Milestones
BackPackage; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, off-center ball grid, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10.
- Universal three M3 clearance.
- 17.5mm panel hole+snip off pin, add holes.
- 236-605, 45Degree (cable under 45degree), 3 pins, pitch.
- 39.5x8.3mm^2, drill diamater 1.3mm, pad diameter 2.5mm.