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LGA 24L 3x3.5mm Pitch 0.43mm LGA 28 5.2x3.8mm Pitch 0.5mm Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm 8-Lead Plastic WSON, 4x3mm Body, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.65mm Pitch, S-PVSON-N8, http://www.ti.com/lit/ds/symlink/opa2333.pdf 3x3mm Body, 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 ST 20-Lead Plastic Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DFN, 10 Pin (https://www.johansontechnology.com/datasheets/0900PC15J0013/0900PC15J0013.pdf), generated with.

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