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Http://www.st.com/resource/en/datasheet/DM00273119.pdf X1-WLB0909, 0.89x0.89mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324 BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf QFN, 48 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DB), generated with kicad-footprint-generator JST PHD series connector, 502386-0670 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 42819-32XX, With thermal vias in pads, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 48 Pin (http://www.ti.com/lit/ds/symlink/msp430f5232.pdf#page=111), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP48: plastic shrink small outline package; 44 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 14 leads; body width 3 mm; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 transistor TO-92 2-pin variant by Heraeus, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments HSOP 9, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole pin header SMD 1x19 1.27mm single row Through hole angled pin header, 1x31, 2.00mm pitch, 6.35mm socket length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted socket strip SMD 1x21 2.00mm single row Through hole pin header THT 1x10 2.54mm single row style1 pin1 left Surface mounted socket strip THT 1x03 1.00mm single row Through hole Samtec HPM power header series 3.81mm post length THT 1x15 5.08mm single row style2 pin1 right Through hole pin header THT 1x22 2.54mm single row style2 pin1 right Through hole angled socket strip, 1x09, 2.54mm pitch, single row Surface mounted pin header THT 1x32 2.54mm single row male, vertical entry Harwin LTek Connector, 44 pins, single row style2 pin1 right Through hole socket strip THT 1x37 2.54mm single row Through hole pin header SMD 1x18 1.00mm single row Surface mounted pin header THT 2x06 1.00mm double row Through hole IDC header, 2x30, 2.54mm pitch, double rows Surface mounted socket strip THT 2x39 2.00mm double row surface-mounted straight socket strip, 2x05, 2.54mm pitch, DIN.

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