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LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition.

• 9.695134e+01 1.062325e+01 facet normal 0.0820278.
• Normal -0.0983909 -0.0148301 -0.995037 vertex.
• 1 6.37595 12.8553 vertex -1.

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