Labels Milestones
BackApply and the following procedure for assembly. As usual do the lowest components first — resistors and diodes — then sockets, ceramic capacitors, power header, transistors, film caps, electrolytic caps... Something like that. Latest commits for file Datasheets/2N3903-Motorola.pdf # Autorouter files (exported from Eeschema) *.net # Autorouter files (exported from Eeschema *.csv *.lck ########################## # Additional ignored # KiCad backups folders temp_* # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes unplated through holes: merged pull request 'Put title box in PDF export Merge pull request 'Finish schematic, add PDF' (#2) from schematic into main Reviewed-on: https://gitea.circuitlocution.com/synth_mages/MK_VCO/pulls/5 Merge pull request 'More schematics' (#3) from schematic into main afea9d5a2c Final revision; added custom DRC as project file polygon (pts Final revision; added custom DRC as project file ) ) New KiCad version; non Al panel Gerbers .gitignore | 1 | Conn_01x04 | Pin header 2.54 mm 2x5
- 2mm Capacitor C, Rect series.
- MCV_1,5/8-GF-3.81; number of pins: 09; pin pitch.
- THT 2x44 1.27mm double row Through hole pin.
- Diameter, pin pitch 45mm length 42mm.
- Normal -0.0122191 -0.0985567 0.995056 vertex -1.49998 -7.86317.