Labels Milestones
Back5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole straight pin header, 1x29, 2.54mm pitch, 6mm pin length, double rows Through hole pin header THT 2x11 2.00mm double row Through hole straight pin header, 1x30, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 1x17 2.54mm single row Through hole angled pin header, 2x04, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight Samtec HPM power header series 3.81mm.
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