3
1
Back

Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x19, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x01 5.08mm single row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x12 2.54mm single row Surface mounted pin header SMD 1x04 1.27mm single row style2 pin1 right Through hole pin header THT 2x30 2.54mm double row Through hole pin header SMD 1x09 2.54mm single row Surface mounted pin header THT 2x15 1.27mm double row Through hole pin header SMD 1x21 2.00mm single row Through hole pin header THT 2x11 1.00mm double row surface-mounted straight pin header, 2x14, 1.27mm pitch, 4.0mm pin length, single row (from Kicad 4.0.7), script generated Through hole.

New Pull Request