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.../Panels/POLYMORPH.png | Bin 0 -> 26572 bytes create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Jack_Hole_NPTH.kicad_mod create mode 100644 3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/UNSEEN SERVANT.png PCB Notes.txt Normal file View File 3D Printing/Pot_Knobs/pot_knob-6mm-clear.stl Executable file Unescape Hardware/PCB/precadsr_aux_Gerbers/precadsr-F_SilkS.gbr Normal file View File 3D Printing/Pot_Knobs/Potentiometer Cap.STL Executable file View File From 4049c4aafe61a54c756e746df9f3a582c255b776 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Add ground fills, fix some clearance issues, add PCB slot, more options for potentiometer spoke placement e8295830c4 STLs, 10hp version, others schematics Replaced accidentally dropped Fine tuning hole. Replaced accidentally dropped Fine tuning hole. Latest commits for file Fireball/Fireball VCO saw wave core.circuitjs.txt Fireball/fp-info-cache Normal file Unescape Hardware/Panel/precadsr-panel/precadsr-panel.pro Normal file View File From abdd18d8f0f754e290e642eee419b44f1d840471 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Update readme Schematics/SEQ_MANUAL_v2.pdf | Bin 69774 -> 0 bytes Latest commits for file Samba_Reggae_1.html Add html test version 77735c00cc3285131373f5cfc61b82eab5963d12 Update README.md 3e868f13c4dc33c20ca33a0cc8f51c9d63e1c081 updated C14 footprint, traces, groundplane 2cbdb94ba9 updated C5 footprint & tracing; schematic annotation 2cbdb94ba94f485ce4abcb1f14e2e5f15d016647 updates the potentiometer pads and thermal vias; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4x4mm package, pitch 0.4mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf QFN, 48 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT232H.pdf#page=49), generated with kicad-footprint-generator ipc_noLead_generator.py 72-Lead Frame Chip Scale Package - 3x3 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Dual Flat, No Lead Package (MR) - 9x9x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 5, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 14-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 10.8x14.26mm 5x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 8-lead.

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