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See http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 24 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted pin header THT 1x16 2.54mm single row Surface mounted pin header THT 1x39 2.00mm single row male, vertical entry Harwin LTek Connector, 44 pins, single row Through hole straight Samtec HPM power header series 3.81mm post length, 1x02, 5.08mm pitch, single row style2 pin1 right Through hole straight pin header, 2x20, 1.27mm pitch, single row Surface mounted socket strip SMD 1x37 2.00mm single row Surface mounted socket strip SMD 2x19 2.00mm double row surface-mounted straight socket strip, 1x22, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x39 2.00mm double row surface-mounted straight pin header, 2x29, 2.00mm pitch, 4.2mm pin length, double.

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