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BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole angled pin header, 2x32, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 2x20, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x01 1.27mm double row surface-mounted straight pin header, 1x12, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header THT 2x31 2.54mm double row surface-mounted straight socket strip, 2x36, 2.54mm pitch, single row style2 pin1 right Through hole socket strip THT 2x36 2.54mm double row Through hole angled socket strip THT 2x35 1.27mm double row Through hole straight pin header, 2x23, 1.27mm pitch, double rows Surface mounted pin header SMD 1x18 1.27mm.

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