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BackGrid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00479-02.pdf), generated with.
- Normal -4.949282e-001 -8.661245e-001 6.981780e-002 facet normal.
- 7.31983 -0.636408 7.07423 facet normal.
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- Size 35.7x7mm^2, drill diamater 1.2mm, pad.