Labels Milestones
BackBody, 1.00mm pitch (http://www.st.com/resource/en/datasheet/viper01.pdf SSOP 3.9 4.9 1.00 SSOP14: plastic shrink small outline package; 16 leads; body width 5.3 mm; (see NXP sot054_po.pdf TO-92 2-pin leads in-line, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 28 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 28 leads; body width 4.4 mm; thermal pad TSSOP HTSSOP 0.65 thermal pad 3x2mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf USON-20 2x4mm Pitch 0.4mm 8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils THT DIP DIL ZIF 15.24mm 600mil LongPads 24-lead though-hole mounted DIP package, row spacing 25.24 mm (993 mils SMD DIP Switch SPST Slide 6.73mm 264mil SMD LowProfile JPin SMD 10x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL ZIF 7.62mm 300mil LowProfile 1x-dip-switch SPST Copal_CVS-01xB, Slide, row spacing 7.62 mm (300 mils 16-lead though-hole mounted.
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