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Wire diameter 0.5mm test point wire loop as test point, loop diameter2.6mm, hole diameter 0.7mm, wire diameter 1.0mm wire loop as test Point, diameter 1.0mm wire loop bead wire loop with bead as test point, pitch 3.81mm, size 7.51x7.3mm^2, drill diamater 1.2mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-1600 (alternative finishes: 43045-022x), 1 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, old mpn/engineering number: 5566-12A2, example for new part number: A-41791-0017 example for new mpn: 39-28-x16x, 8 Pins per row (https://datasheet.lcsc.com/lcsc/1811040204_JUSHUO-AFC07-S32FCC-00_C11061.pdf Jushuo AFC07, FFC/FPC connector, FH12-40S-0.5SH, 40 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST NV series connector, B04B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0110, 11 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-104-02-xxx-DV-BE-A, 4 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 42820-52XX, With thermal vias in pads, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Capacitor SMD 0504 (1310 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Infineon, PG-TISON-8-2, 5x6x1.15mm, 1.27mm Pitch, Exposed Paddle, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-4/ Infineon, PG-TISON-8-5, 8x8x1.1mm, 1mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-5/ VML0806, Rohm (http://rohmfs.rohm.com/en/techdata_basic/transistor/soldering_condition/VML0806_Soldering_Condition.pdf, http://rohmfs.rohm.com/en/products/databook/package/spec/discrete/vml0806_tr-e.pdf MicroCrystal C3 2.5x3.7mm, https://www.microcrystal.com/fileadmin/Media/Products/RTC/Datasheet/RV-1805-C3.pdf SON, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf), generated with kicad-footprint-generator Hirose series connector, S09B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py GPS Module, Linx (https://linxtechnologies.com/wp/wp-content/uploads/rxm-gps-rm.pdf Quectel L80-R GPS Module, 15.5x15.5x6.3mm, https://www.u-blox.com/sites/default/files/SAM-M8Q_HardwareIntegrationManual_%28UBX-16018358%29.pdf GPS GNSS ublox ZED GSM NB-IoT module, 15.8x17.7x2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC66_Hardware_Design_V1.1.pdf GSM NB-IoT module, 19.9x23.6x2.2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC95_Hardware_Design_V1.3.pdf GSM NB-IoT module BC95 Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865 familly footprint, http://www.telit.com/fileadmin/user_upload/products/Downloads/3G/Telit_UL865_Hardware_User_Guide_r8.pdf ublox Sara GSM/HSPA modem, https://www.u-blox.com/sites/default/files/SARA-G3-U2_SysIntegrManual_%28UBX-13000995%29.pdf, pag.162 ublox SARA-G3 SARA-U2 GSM HSPA Footprint for Mini-Circuits case TTT167 (Mini-Circuits_TTT167_LandPatternPL-079) following land pattern PL-035, including GND-vias (https://www.minicircuits.com/pcb/98-pl258.pdf Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf Footprint for Mini-Circuits case MMM168, Land pattern PL-094, pads 5 and 6); middle of panel after deducting left/right sub-panels slider_center = (width_mm - left_panel_width - right_panel_width)/2 + left_panel_width; slider_bottom = v_margin+8; Panels/10_step_seq_38hp_v1.scad Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/DIP-14_W7.62mm_Socket_LongPads.kicad_mod Normal file View File MK_VCO_RADIO_SHAEK.diy Executable file View File Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-drl_map.pdf Normal file Unescape Schematics/SynthMages.pretty/C_Rect_L22.0mm_W6.1mm_P20mm_MKT_BIG_RED_CAP.kicad_mod Normal file View File 3D Printing/Cases/Eurorack Modular Skeleton/CE3_Eurorack_box_v105.3mf Executable file View File Synth_Manuals/The MIDI Manufacturers Association - 1995.

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