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SPST Copal_CVS-04xB, Slide, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads THT DIP DIL ZIF 25.4mm 1000mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 3x-dip-switch SPST Copal_CVS-03xB, Slide, row spacing 6.15 mm (242 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 7.62 mm (300 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 10.8x6.64mm 2x-dip-switch SPST Copal_CHS-02A, Slide, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf SMD DIP Switch SPST Piano 7.62mm 300mil PowerIntegrations variant of 8-Lead Plastic Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (https://www.onsemi.com/pub/Collateral/NUF4401MN-D.PDF#page=6), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 16 Pin (JEDEC MO-153 Var JC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex Pico-Lock series connector, 14111113010xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13010XXX_100228421DRW063C.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1230, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with.

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