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Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes unplated through holes: ============================================================= f51b7b97734e404127fa5d5d263acbfd66f116e4 Bring in diylc and openscad design Add Kick as separate sheet 2d3c489f2acf0f8bdc9cf0fe8c2346d4d07472be More SR1 notation More SR1 notation main master PSU/Synth Mages Power Word Stun.kicad_prl 78 lines From 325d28022a5ac3ecda4a68ca826636c0d35a65a5 Mon Sep 17 00:00:00 2001 Subject: [PATCH] More notes C10, C14 too small for film; is film needed? - Fix R25/R1 connection One socket connection is on the classic "Maths" module exist for modifying a CV in complex ways. - CV Out - 1K to U2-14 Case Out - 1K to.

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