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Back2x3x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Package-Files/SO-8EP.pdf 20-Lead Plastic Quad Flat, No Lead Package (MA) - 2x2x0.9 mm Body [QFN]; (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf MLF, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T3255-3)), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0003 example for new mpn: 39-28-902x, 1 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose DF63 through hole, DF13-05P-1.25DS, 5 Pins per row, Mounting: PCB Mounting Flange (http://www.molex.com/pdm_docs/sd/039291047_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_64_7.pdf), generated with kicad-footprint-generator ipc_dfn_qfn_generator.py QFN, 16 Pin (https://www.haloelectronics.com/pdf/discrete-ultra-100baset.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch.
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